Thermal Interface Materials & Dielectrics

Measuring the Thermal Conductivity of TIMs & Dielectrics

As electronics become smaller and more powerful, there becomes a need to explore options for cooling and thermal dissipation of the electronic. Thermal interface materials (TIMs) are a common material used in electronics to transfer the heat away from hot components to cooling hardware. TIMs are designed to fill in air gaps, which act as thermal insulation, to provide for improved heat transfer, lower thermal resistance and overall better cooling of the electronic.

Thermal conductivity plays a vital role in the research and design of new thermal interface materials. Researchers seeking better performing TIMs create materials with high thermal conductivity values to improve heat transfer between layers.