This keynote session took place as part of the Advancements in Thermal Management Conference in August 2020.
Abstract: Poor thermal management generally results in weaker product performance, a reduction in the product lifecycle and an overall negative experience for the user. Careful attention must be paid to thermal management in process and product design. To ensure product success, accurate understanding of component thermal conductivity is a critical performance attribute .
This session will provide an overview on innovations in characterizing the thermal conductivity of:
– Conductive Packaging
– Phase Change Materials (PCMs)
– Thermal Interface Materials (gap pads, thermal grease)
– Battery Components
– Thin Films
Join us to learn more about expanded capabilities offered with the application of transient methods for thermal performance testing.
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