All of today’s advanced electronics contain some form of thermal management which aids to reduce the thermal load on critical components. The use of thin interfacial films, encapsulating potting compounds and metallic heat sinks are just a few types of materials that can be employed in such applications. While there are a range of factors to consider, thermal conductivity is amongst the most important when determining overall efficiency with respect to thermal dissipation. Thermal conductivity characterization on some of these more complex materials are not always so straight forward. It is important to properly understand the type of material being tested and selecting the most appropriate method accordingly.
This webinar will explore the use of the C-Therm’s FLEX Transient Plane Source (TPS) method for the characterization on a range of materials. The FLEX TPS method available on the Trident platform provides users with advanced utilities for testing both isotropic and anisotropic materials ranging from bulk solids to thin films. We will discuss how to determine the correct method; illustrate how they are employed and highlight various example data sets collected on a range of material types. This webinar will be of interest to materials scientists and engineers in the fields of conductive polymers and polymer composites research.
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