Thermal Conductivity Mapping and Filler Settling Effects Detection of Polymer Composites

Doping a material can introduce new and beneficial performance properties. Whether the goal is to increase thermal transfer properties through conductive fillers, or increase thermal resistance via insulative materials, the uniformity of filler dispersion will be crucial to overall performance. Localized agglomeration and inhomogeneous dispersion will adversely affect the performance of the material and can lead to thermal management issues. The ability to detect this is important to ensure materials are being manufactured and function as intended.

Thermal Conductivity Hot Spots (illustration)

Thermal conductivity (k) can be used as a metric to help detect these potential issues. While thermal conductivity can be measured via multiple methods, the ability to detect localized differences related to fillers is readily accomplished using C-Therm’s Modified Transient Plane Source (MTPS). Being a single-sided sensor with a small active area (approx. 18 mm) it is easy to map the surface of a material and detect differences related to the additives. As a transient method, it also offers extremely fast test times allowing full characterization in minutes which is invaluable in both R&D and QA/QC applications.

Join us for this webinar where we will discuss the importance of thermal mapping and spot testing of filled materials. The MTPS will be highlighted as the ideal method for this type of characterization and examples on how this testing can be performed will be shown on a variety of materials. We will also cover various case highlights on general filled polymer materials across various industries and their implications on end use performance.

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