When assembling electronics modules, manufacturers aim to optimize processes to reduce costs. The choice of adhesive can greatly impact those costs, through the energy use, process time and other factors. The choice of adhesive, likewise, can impact eventual thermal management performance of the electronic device. Through application of innovative new adhesive materials, improved thermal performance can be achieved.
This webinar will explore methods of thermal performance characterization of these materials. Method selection and application will be explored. This webinar is for materials scientists and engineers of materials used as adhesives in electronics devices, particularly with an interest in performance validation.
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