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Thermal Conductivity Instrument for

Thermal Interface Materials (TIMs)

Leading researchers use the C-Therm Trident Thermal Conductivity Instrument and ZFW TIM-Tester to characterize the thermal conductivity of thermal interface materials, including thermal greases, gap fillers, phase change materials, and thermally conductive pads, supporting applications in electronics cooling, battery thermal management, semiconductor packaging, and advanced thermal design. Measurements are performed in accordance with standardized test methods, including ISO 22007-2, ISO 22007-7, ASTM D7896, ASTM E3088, and ASTM D5470.
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Why Thermal Conductivity Measurement Matters for TIMs

Thermal conductivity is a key performance parameter for thermal interface materials (TIMs) used in electronics cooling, semiconductor packaging, battery systems, and high-power devices. TIMs reduce interfacial thermal resistance between components and heat sinks, directly improving efficiency, reliability, and operational lifetime.
Accurate measurement across TIM types—including greases, gap fillers, phase change materials, adhesives, and thermally conductive pads—requires techniques capable of handling soft, heterogeneous, and compressible materials. Performance depends not only on bulk material properties but also on heat transfer across interfaces under application-relevant contact conditions.
C-Therm Trident and ZFW TIM-Tester instruments enable rapid, reliable thermal conductivity characterization across TIM formulations, supporting materials development and quality control in advanced thermal management applications.

Thermal Conductivity Testing Instruments for TIMs

C-Therm Trident Thermal Conductivity Instrument

The C-Therm Trident Thermal Conductivity Instrument is engineered to characterize a wide range of thermal interface materials under conditions that reflect real-world device operation. It delivers fast, accurate, and repeatable thermal conductivity measurements for TIMs such as thermal greases, gap fillers, phase change materials, adhesives, and pads—supporting applications in electronics cooling, semiconductor packaging, battery systems, and high-power device thermal management.

Form Factor Test a Variety of Form Factors
Measure cured and uncured materials, anisotropic samples, thin films, cooling liquids, pastes, pads, greases, adhesives, and samples of limited volume.
Representative Test Conditions Representative Test Conditions
Test materials under compression and other application conditions including temperature, pressure, humidity, thermal cycling, and aging.
Accelerated Time to Market Accelerated Time to Market
Facilitate down selection of materials by quickly comparing TIM formulations and identifying filler dispersion, sedimentation, and agglomeration issues earlier in development.
Standards Ready Data Standards-Ready Data
Generate reliable data and validate technical data sheets conforming to industry standards ISO 22007-2, ISO 22007-7, ASTM 7896 and ASTM E3088.

ZFW TIM-Tester

The ZFW TIM-Tester, developed by the Zentrum für Wärmemanagement (ZFW) in Stuttgart, is a high-precision system for the characterization of thermal interface materials (TIMs). Based on the stationary cylinder method in accordance with ASTM D5470, it enables accurate determination of thermal resistance and effective thermal conductivity across a wide range of materials, including gap fillers, gap pads, greases, pastes, adhesives, tapes, solids, and liquids.

Since its introduction in 2012, the TIM-Tester has become widely recognized for its exceptional measurement precision, particularly its fine gap resolution and flexible operating modes. It supports both pressure- and gap-controlled testing, making it a reliable solution for advanced TIM evaluation in research and development environments.

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See It in Action

Request a demo to see how the C-Therm Trident or the ZFW TIM-Tester delivers fast, accurate, and repeatable thermal conductivity measurements for TIMs applications.

 

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Customer Success Stories

  • Intel Corporation
    C-Therm’s Trident system allows us to not only test a relatively broader range of materials with various sensor techniques, but with the slab utility we are able to easily test the thermal conductivity of our thin film aluminum alloys – which have high value in today’s electronic computing and hardware.
    Hardeep Singh
    Sr. Thermal Engineer
  • MG Chemicals
    Adding the Trident system to our lab this year has resulted in more efficient thermal conductivity measurements, and we have begun to integrate it into our quality control process to great success.
    Alexander Hudson
    Research and Development Manager
  • BECHEM
    Traditional methods fell short of expectations due to their low upper measurement limits, long testing times, and the need for high sample volumes. C-Therm’s solution… provides quick measurements, requires only small sample amounts, and accurately and consistently measures high thermal conductivities… software is clean and intuitive…rare and very welcome feature for laboratory equipment… support has been top-notch… With the Trident, we were able to realize our vision of producing high-performance thermal greases and pastes…
    Sebastian Bruchhagen
    R & D Grease
  • University of Exeter Cornwall
    … highly impressed with the performance of the C-Therm Thermal Trident system …. Its precision and ease of use …significantly streamlined our material testing process. The ability to quickly and accurately measure the thermal conductivity of various materials, including complex composites and nanomaterials, has been invaluable to our work. The system's non-destructive testing capabilities… with its sensitivity to even subtle variations in thermal properties… provided us with critical insights … enhanced the overall efficiency and reliability of our thermal analysis workflows.
    Anurag Roy
    Research Fellow

Trident Specifications

Test Method MTPS TPS THW
Thermal Conductivity Range 0.01 to 500 W/mK 0.005 to 2000 W/mK 0.01 – 2 W/mK
Heat Capacity Range Up to 5 MJ/m³K* Up to 5 MJ/m³K Better than 10%
Temperature Range -50 to 200 °C -200 to 600 °C -40 to 200 °C
Precision Better than 1% Better than 2% Better than 1%
Accuracy Better than 5% Better than 3% Better than 5%
Test Time 0.8 to 3 secs 10 to 180 secs less than 1 sec
Sensor Size 18 mm dia 6, 13, 30 mm sensors 45 mm length
International Standards ISO 22007-2
ISO 22007-7
ASTM E3088
ASTM D7896

*Calculated parameter

Frequently Asked Questions

What is thermal conductivity and why does it matter for thermal interface materials?

Thermal conductivity is a material’s ability to transfer heat, measured in W/mK. For thermal interface materials — gap pads, greases, pastes, phase change materials, and adhesives — it is a primary performance indicator. A TIM with insufficient thermal conductivity creates a thermal bottleneck between a heat source and a heat sink, leading to elevated operating temperatures, reduced component lifespan, and potential system failure. Accurate characterization is therefore essential at every stage of TIM development and qualification.

What is the best method to test the thermal conductivity of TIMs?

There are several established methods for testing TIMs, and the best choice depends on your specific requirements.

MTPS (Modified Transient Plane Source) is the simplest, fastest, and most automated method for TIM thermal conductivity characterization. C-Therm’s patented MTPS technology, available on the Trident Thermal Conductivity Platform, is widely used for rapid screening and formulation development. It is particularly effective for identifying filler sedimentation and agglomeration, which can significantly impact TIM performance, and is well suited for material selection and quality control where repeatability and ease of use are critical. MTPS supports a wide range of formats, including pads, tapes, pastes, adhesives, and phase change materials.

TPS (Transient Plane Source) is the double-sided ‘hot disc’ method and is compliant with ISO 22007-2, ISO 22007-7 and E3088. It is one of the most widely referenced methods on TIM datasheets and is well suited for advanced users requiring greater control over test parameters such as power and measurement time. TPS can also be used to evaluate anisotropic thermal conductivity when density and heat capacity are known. MTPS and TPS are complementary techniques available on the C-Therm Trident platform, offering both rapid measurements within a single system.

THW (Transient Hot Wire) is well suited for testing coolants and heat transfer fluids, where convective stability and low-viscosity behavior are important, providing reliable thermal conductivity measurements for fluid-based thermal management systems.

ASTM D5470 (ZFW TIM-Tester) is a steady-state comparative method used to measure thermal resistance (thermal impedance) of thermal interface materials. The ZFW TIM-Tester enables direct evaluation of through-plane thermal transport under controlled temperature and pressure conditions, making it highly relevant for electronics cooling applications. The method captures the combined effects of material thermal conductivity, thickness, surface roughness, and interfacial contact resistance, all of which strongly influence real-world heat transfer performance.

Each method provides distinct and complementary insights, together forming a comprehensive toolkit for evaluating thermal performance in TIMs and thermal management fluids.

What is the importance of TIM testing?

TIM testing refers to the thermal characterization of thermal interface materials, including measurements such as thermal conductivity, thermal resistance (or thermal impedance), and interfacial heat transfer performance. These properties are used to evaluate how effectively a TIM facilitates heat flow between mating surfaces under applied pressure and temperature conditions. Accurate thermal characterization helps predict in-use performance, reduce thermal bottlenecks, and improve reliability and efficiency in electronics, EV batteries, telecommunications systems, and other high-power applications.

What parameters affect the thermal performance of TIMs?

TIM performance is influenced by:

  • Compression state / applied pressure
  • Temperature
  • Quality of interface contact
  • Filler type, size, and loading
  • Dispersion quality (agglomeration/sedimentation)
  • Polymer matrix composition
  • Cure state (for adhesives)
  • Thickness. and
  • Mechanical properties
Can the Trident measure the thermal conductivity of TIMs in paste or grease form?

Yes. The MTPS sensor is designed to accommodate pastes, greases, and other semi-solid TIM formats without specialized sample preparation. Liquid and low-viscosity TIMs can be tested using the MTPS Liquids & Powders Cell or the THW sensor. The single-sided nature of the MTPS sensor makes it particularly practical for sticky or non-self-supporting materials that are difficult to handle with double-sided sensor techniques.

Can TIMs be tested for anisotropic thermal conductivity?

Yes. Anisotropy (in-plane vs. through-plane conductivity) can be measured using TPS (ISO 22007-2) when density and heat capacity are known.

Can you test phase-change materials (PCMs) or low-viscosity greases?

Yes. MTPS and TPS can test PCMs, greases, gels, and adhesives. Additional sample containment may be recommended depending on viscosity.

Why is compression control important when testing TIMs?

TIMs are often compressible, and applied pressure affects their:

  • Thickness
    Density
    Contact quality
    Measured thermal conductivity/impedance
    To obtain representative and repeatable results, the TIM must be tested under controlled, application-relevant compression conditions.

C-Therm’s Compression Test Accessory (CTA) provides adjustable, reproducible loading and is compatible with both MTPS and FLEX TPS (Hot Disc) test methods.

How does the Trident's Compression Test Accessory (CTA) support TIM testing?

The Compression Test Accessory (CTA) enables users to precisely control the level of compression applied to a sample during MTPS testing. Since many TIMs — including gap pads, greases, and pastes — exhibit pressure-dependent thermal conductivity, the CTA ensures that measurements are taken under conditions representative of actual application use. It is compatible with solid, paste, grease, and powder TIM formats and is particularly valuable for benchmarking competing products under standardized compressive loads.

What is the ZFW TIM-Tester and what makes it different from other ASTM D5470 instruments?

The ZFW TIM-Tester, developed by the Zentrum für Wärmemanagement (ZFW) in Stuttgart and has been the market benchmark for TIM characterization since 2012. It is distinguished by its high-precision optical gap measurement — with a resolution of 0.1 μm and absolute accuracy of ±4 μm — which accounts for material compression and thermal expansion during testing. This results in reproducibility of less than 1 mm²K/W, the best available in the market. It supports both gap-controlled and pressure-controlled measurement modes (up to 2 N/mm²), making it suitable for the full range of TIM forms, from low-viscosity pastes to rigid gap pads.

What is thermal contact resistance and how is it measured?

Thermal contact resistance (TCR) is the resistance to heat flow at the interface between a TIM and the mating surfaces it contacts. It arises from microscopic surface roughness, air gaps, and wettability effects. The ZFW TIM-Tester isolates TCR by measuring thermal resistance at multiple bondline thicknesses and extrapolating the interface contribution. This enables engineers to distinguish between the TIM’s intrinsic bulk thermal conductivity and the additional resistance introduced at the interface — a critical distinction for accurate thermal stack modeling.

What temperature range is supported for TIM testing with the Trident and ZFW TIM-Tester?

The Trident MTPS sensor operates from -50°C to +200°C, and the Flex TPS sensor from -200°C to +600°C, making it suitable for characterizing TIMs across a wide range of operating environments. The ZFW TIM-Tester supports sample temperatures from 10°C to 150°C, with a hot-side capacity up to 175°C, covering typical electronics and EV operating conditions. Temperature-dependent measurements can reveal how TIM performance changes under real-use thermal cycling conditions.