Trident™ Application Highlight: Thermal Conductivity of Thermal Interface Materials Measured with MTPS
This document highlights the use of the Modified Transient Plane Source (MTPS) method for characterizing the thermal conductivity of thermal interface materials (TIMs), including gap pads and potting compounds.
TIMs are used in electronic devices to aid heat transfer between heat-generating, temperature-sensitive components and heat sinks. They are available in numerous formats, including pastes, greases, adhesives, potting compounds, phase change materials, and gap pads. In all formats, thermal conductivity is the primary performance metric governing heat dissipation capability. Accurate characterization is essential for both performance optimization and thermal runaway avoidance in battery and power electronics applications.
Figure 1. Thermal interface materials being applied to an electronic board
Measurements were performed using the Modified Transient Plane Source (MTPS) method, available exclusively on the Trident Thermal Conductivity Instrument. A gap pad TIM was tested under varying compressive force loads (75 g, 500 g, and 2000 g) using the Compression Test Accessory (CTA) to demonstrate the force-conductivity relationship. A cured potting compound was tested under minimal applied load using both MTPS and TPS methods for method comparison.To read more, download the PDF below!