PolymersBelow is an example of a thermal expansion report produced by Thermal Analysis Labs.
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Polymers
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Example TMA Test Report Thin Films
Trident™ Thermal Conductivity Application Highlight: Thermal Mapping and Filler Settling Detection in Polymer Composites With MTPS
The following Application Highlight features the use of the Modified Transient Plane Source method as a qualitative screening tool for the detection of filler dispersion uniformity in polymer...
Trident™ Thermal Conductivity Application Highlight: Monitoring Resin Stability and Sedimentation with MTPS
The following Application Highlight summarizes the use of C-Therm’s MTPS method in monitoring the stability of a filled resin system.
Thermally conductive adhesives are a key component for...
Lightweight alkali-activated materials and ordinary Portland cement composites using recycled polyvinyl chloride and waste glass aggregates to fully replace natural sand
Abstract: Polyvinyl chloride plastic (PVC) and glass waste have proven to be significant environmental concerns considering their restricted reuse and complicated recycling procedures. Glass and PVC...
Organic thermoelectric materials and devices based on p- and n-type poly(metal 1,1,2,2-ethenetetrathiolate)s
Abstract: A series of metal coordination polymers containing 1,1,2,2-ethenetetrathiolate (ett) linking bridge (poly[Ax(M-ett)]) are synthesized. The Seebeck coefficients of these conducting materials...
Effect of different fillers on thermal conductivity, tribological properties of Polyamide 6
Abstract: An influence of different filler types and filler content on the thermal and abrasive wear properties of polyamide-6 is investigated. Al2O3, MgO, two glass powders with different...
Experimental Investigations and Analytical Models of Water-Magnetite (Fe3O4) Nanofluids for Polymer Electrolyte Membrane (PEM) Fuel Cell Cooling Application
Abstract: Water magnetite nanofluids for Polymer Electrolyte Membrane (PEM) fuel cell cooling application have been investigated. Nanofluid of water-magnetite (Fe3O4) has been synthesized using a...
Development of thermal conductive paste for enhancing the heat transfer rate in electrical and electronic devices
Abstract: The growth in modern micro or nano electronic chips and electrical devices in the market, with the aim for developing a highly efficient processing machine. However, heat dissipation is a...
Thermal, electrical and mechanical properties of carbon fiber/copper powder/carbon black reinforced hybrid Polyamide 6,6 composites
Abstract: The development of low electrical and thermal properties of Polyamide (PA), which is used in place of metals in engineering applications, draws attention to the developments in various...