Trident™ Thermal Conductivity Application Highlight: Characterizing Performance of a Thermal Adhesive for EV Battery Packs
The following Application Highlight addresses the measurement of both an uncured and cured thermal adhesive material using the Modified Transient Plane Source (MTPS) method in collaboration with HB...
Development of thermal conductive paste for enhancing the heat transfer rate in electrical and electronic devices
Abstract: The growth in modern micro or nano electronic chips and electrical devices in the market, with the aim for developing a highly efficient processing machine. However, heat dissipation is a...