Modification of epoxy resin matrix by high-performance mesoporous silica@graphene nanocomposites
Abstract: High-performance composites were made with sheet graphene (GNP) and spherical silica (SiO2) as mesoporous nanofillers. The nanofillers are composed of SiO2 tightly wrapped on GNP by the...
Trident™ Thermal Conductivity Application Highlight: Measuring Thin Film Samples using Flex TPS Sensor
The following Application Highlight addresses the measurement of polymeric thin films using the Flex Transient Plane Source (TPS) sensor and the Thin Films utility available on Trident.
Thin...
Trident™ Thermal Conductivity Application Highlight: Characterizing Performance of a Thermal Adhesive for EV Battery Packs
The following Application Highlight addresses the measurement of both an uncured and cured thermal adhesive material using the Modified Transient Plane Source (MTPS) method in collaboration with HB...
Trident™ Thermal Conductivity Application Highlight: Measuring Thermal Conductivity of Thermal Interface Materials with MTPS
The following Application Highlight features the use of the Modified Transient Plane Source method in the thermal conductivity testing of thermal interface materials (TIMs).
TIMs are employed as a...
Covalently bonded silica interfacial layer for simultaneously improving thermal and dielectric performance of copper/epoxy composite
Copper/epoxy (Cu/epoxy) composite is a kind of important thermal management material due to its high thermal conductivity, excellent mechanical robustness and low cost. However, susceptibility of Cu...