Thermal Conductivity Characterization of Thermal Interface Materials

Thermal interface materials (TIMs) are widely used to more effectively transfer heat through a thermal interface.  Often taking the form of a  thermal pad or paste, TIMs help to bridge the microspheric air gap between two surfaces; often used in electronics to increase heat dissipation through a heat sink.

Researchers worldwide have been improving TIMs for decades, both in their form, function and capabilities.  This webinar will highlight how the TCi Thermal Conductivity Analyzer was used in the characterization of a variety of TIMs, looking specifically at recent work in gallium-based thermal interface materials with high compliance and wettability.  With thermal conductivity being a key performance factor for TIMs, the C-Therm TCi is widely used to characterize advancements in the field.

This webinar will be of particular interest to any thermal interface engineers and researchers.


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