Trident™ Application Highlight: Thermal Conductivity of Concrete Using the 60 mm TPS Sensor
This document highlights the use of the Transient Plane Source (TPS) method to characterize concrete thermal conductivity and demonstrates the advantages of the 60 mm sensor for heterogeneous...
Trident™ Application Highlight: Thermal Conductivity of Concrete and Cementitious Materials
This document highlights the use of the Transient Plane Source (TPS) method to characterize the bulk thermal conductivity of concrete
Measurements were performed using the Transient Plane...
Trident™ Application Highlight: Impact of Saturation on the Thermal Conductivity of Subsurface Geomaterials
This document highlights the use of the Transient Plane Source (TPS) method to characterize the thermal conductivity of sandstone and shale core samples at varying saturation levels, in accordance...
Use of Thermomechanical Analysis (TMA) in Sintering Simulation of Ceramics
The sintering process of ceramics or metal injection molding (MIM) can be divided into the debinding and the sintering processes. Conventionally, TG-DTA (STA) is used to investigate the debinding...
Trident™ Thermal Conductivity Application Highlight: The Role of Thermal Conductivity in Electric Motors
In electric motor (e-motor) applications, thermal management is a critical design consideration due to the high power densities and compact packaging typical of modern systems. As motors operate,...
Thermal Behavior of Paraffin Wax by Sample Observation DSC
Phase change material or PCM is a material that can absorb, store and release large amounts of latent heat within a specific temperature range during phase transition reaction. Several materials have...
Glass Transition Measurement with DMA
Historically, Tg has been characterized by DSC (Differential Scanning Calorimetry), which is a thermo-analytical method monitoring the difference in heat flow between the material’s
specimen and a...
Thermal Analysis of PCB by TMA
A printed circuit board or PCB is usually composed of epoxy resin with reinforced woven glass fibers where electrical components and conducting layers are mounted. The PCB board and the components...
Trident™ Application Highlight: Thermal Conductivity of Thermal Interface Materials Under Compression
This document highlights the use of the Transient Plane Source (TPS) method to characterize the thermal conductivity of silicone and non-silicone thermal interface materials (TIMs) under varying...