Characterization of Aging Effects on Thermal and Mechanical Properties of Magnetically-Oriented ACA for Flexible and Stretchable Electronics
Next-generation electronics will rely heavily on easily customizable electronic devices and systems that can be quickly and affordably manufactured and integrated using various deposited materials on...
Trident™ Thermal Conductivity Application Highlight: Measuring Thin Film Samples using Flex TPS Sensor
The following Application Highlight addresses the measurement of polymeric thin films using the Flex Transient Plane Source (TPS) sensor and the Thin Films utility available on Trident.
Thin...
Trident™ Thermal Conductivity Application Highlight: Testing Aluminum Foil with TPS Slab Utility
The following Application Highlight details the use of the slab utility in testing thin foils of highly conductive metals. C-Therm’s Trident™ thermal conductivity instrument using the...
Trident™ Thermal Conductivity Application Highlight: Characterizing Thermal Performance of Self-Adhesive Tapes for EV Battery Applications
The following Application Highlight addresses the measurement of self-adhesive tapes using the Modified Transient Plane Source (MTPS) method in collaboration with tesa tapes.
Pressure sensitive...
The effect of filler localization on morphology and thermal conductivity of the polyamide/cyclic olefin copolymer blends filled with boron nitride
In this study, the microstructural development and its effect on the thermal conductivity of polyamide/cyclic olefin copolymer (PA/COC) blends containing boron nitride (BN) particles were...
Effect of vacuum insulation panel integration in phase change material-based passive thermal management system for electronics package exposed to hot air environment
Abstract: Harsh environment conditions are challenging for thermal management of electronics devices due to the thermal load from the surroundings. Phase Change Material (PCM) based Passive...
Large-scale production of boron nitride nanosheets-based epoxy nanocomposites with ultrahigh through-plane thermal conductivity for electronic encapsulation
Abstract: Recent advances in two-dimensional (2D) nanomaterials have generated great interest in the investigations of these materials for wide ranging applications in the micro- to nano-scale...
Temperature adjustable thermal conductivity and thermal contact resistance for liquid metal/paraffin/olefin block copolymer interface material
Abstract: The adjustable thermal conductivity and thermal contact resistance are the key ways to realize efficient thermal management of electronic devices. In this work, a low melting-point...