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Thermal protection by integration of vacuum insulation panel in liquid-cooled active thermal management for electronics package exposed to thermal radiation
Abstract: Thermal Management Systems (TMSs) working for electronics packages under harsh environments like intense thermal radiation is challenging due to external thermal interactions. Thermal...
Improved Potting of Litz Wires for High Power Density Electric Motor
Specific details including selections of process materials, tooling/fixture setups, and a stepby-step procedure for scaling-up demonstrations of the newly developed potting process, namely...
Enhanced thermally conductive and thermomechanical properties of polymethyl methacrylate (PMMA)/graphene nanoplatelets (GNPs) nanocomposites for radiator of electronic components
In this work, multi-layer hot pressing (MLHP) method was used to prepare the graphene nanoplatelets (GNPs) filled polymethyl methacrylate (PMMA) composites. Effect of GNP content on the viscoelastic...
Mechanical, Thermal and Electrical Property Enhancement of Graphene-Polymer Nanocomposites
In this work, NanoXplore’s proprietary graphene nanoplatelets, heXo-G V20, are melt-extruded into thermoplastics LLDPE, HDPE and TPU. Graphene is shown to effectively increase the stiffness and the...
Innovations in Thermal Conductivity Component Testing for Electronics and Battery Thermal Management
The following keynote presentation took place at the Advancements in Thermal Management Conference in August 2020.  Poor thermal management generally results in weaker product performance, a...
Fabrication of silicon on insulator wafer with silicon carbide insulator layer by surface-activated bonding at room temperature
We propose a process for the fabrication of a silicon-on-insulator (SOI) wafer with a silicon carbide (SiC) insulator layer by combining plasmaenhanced chemical vapor deposition and surface-activated...