The following is an excerpt from the paper Building materials thermal conductivity measurement and correlation with heat flow meter, laser flash analysis, and TCi. The thermal conductivities of various building materials such as wood floor, wall materials, plywood, and high density fiber (HDF) were measured using a heat flow meter (HFM), laser flash analysis (LFA) and C-Therm’s Thermal Conductivity Instrument (TCi) using the Modified Transient Plane Source (MTPS) method.
“This experiment was conducted to measure the correlation in the thermal conductivities measured using TCi <employing the MTPS method>, as well as HFM (KS L 9016) and LFA (KS L 1604) that are included in the existing KS standard.
An examination of the correlation by measuring the thermal conductivity of various materials using HFM and TCi revealed a high coefficient of correlation (R2) of more than 0.9. Accordingly, the thermal conductivity measured using TCi can be accepted with confidence, as the thermal conductivity measured using HFM and TCi showed a high correlation for wood flooring, wall materials, and plywood with an increased mass percentage of reformed graphite and HDF.
The thermal conductivity measured using LFA and TCi for the epoxy adhesive with an increased mass percentage of reformed graphite showed a high coefficient of correlation (R2) of 0.978. Accordingly, the thermal conductivity measured using TCi for the epoxy adhesive with an increased mass percentage of reformed graphite can be accepted with confidence. However, the thermal conductivity measured using LFA and TCi for the HDF with an increased mass percentage of reformed graphite showed a very low coefficient of correlation (R2) of 0.504 because the thermal conductivity in the LFA experiment did not increase consistently. Based on this result, the value obtained by using LFA cannot be accepted with confidence since it is not suitable for measuring the thermal conductivity of consistent materials such as HDF. Contrary to the existing method, TCi can conveniently measure thermal conductivity by using various sample shapes. The device is expected to find wide application and use in various areas due to its small size that allows convenient measuring of thermal conductivity even in places of spatial restrictions.”
See the article here: https://ctherm.com/resources/tech-library/building-materials-thermal-conductivity-measurement-and-correlation-with-heat-flow-meter-laser-flash-analysis-and-tci/