Trident™ Thermal Conductivity Application Highlight: Potting and Impregnation Materials
The following Application Highlight addresses the measurement of materials used for potting and impregnation applications using the Modified Transient Plane Source (MTPS) method.
Potting and...
Trident™ Thermal Conductivity Application Highlight: Accelerated Thermal Conductivity Testing of Aerogels with MTPS
The following Application Highlight features the use of the Modified Transient Plane Source method in the thermal conductivity testing of aerogels.
Aerogels represent a class of ultra-lightweight...
Trident™ Thermal Conductivity Application Highlight: Thermal Mapping and Filler Settling Detection in Polymer Composites With MTPS
The following Application Highlight features the use of the Modified Transient Plane Source method as a qualitative screening tool for the detection of filler dispersion uniformity in polymer...
Trident™ Thermal Conductivity Application Highlight: Measuring Thin Film Samples using Flex TPS Sensor
The following Application Highlight addresses the measurement of polymeric thin films using the Flex Transient Plane Source (TPS) sensor and the Thin Films utility available on Trident.
Thin...
Trident™ Thermal Conductivity Application Highlight: Monitoring Resin Stability and Sedimentation with MTPS
The following Application Highlight summarizes the use of C-Therm’s MTPS method in monitoring the stability of a filled resin system.
Thermally conductive adhesives are a key component for...
Trident™ Thermal Conductivity Application Highlight: Characterizing Performance of a Thermal Adhesive for EV Battery Packs
The following Application Highlight addresses the measurement of both an uncured and cured thermal adhesive material using the Modified Transient Plane Source (MTPS) method in collaboration with HB...
Trident™ Thermal Conductivity Application Highlight: Characterizing Thermal Performance of Self-Adhesive Tapes for EV Battery Applications
The following Application Highlight addresses the measurement of self-adhesive tapes using the Modified Transient Plane Source (MTPS) method in collaboration with tesa tapes.
Pressure sensitive...
Development of thermal conductive paste for enhancing the heat transfer rate in electrical and electronic devices
Abstract: The growth in modern micro or nano electronic chips and electrical devices in the market, with the aim for developing a highly efficient processing machine. However, heat dissipation is a...
Preparation of Graphene-Based Hydrogel Thermal Interface Materials with Excellent Heat Dissipation and Mechanical Properties
Abstract: Heat dissipation has become an essential factor affecting the performance and operating life of electronic devices as the development of modern electronic devices continues to miniaturize...