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Tech Library

Thermal Interface Materials

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Development of thermal conductive paste for enhancing the heat transfer rate in electrical and electronic devices
Abstract: The growth in modern micro or nano electronic chips and electrical devices in the market, with the aim for developing a highly efficient processing machine. However, heat dissipation is a...
Preparation of Graphene-Based Hydrogel Thermal Interface Materials with Excellent Heat Dissipation and Mechanical Properties
Abstract: Heat dissipation has become an essential factor affecting the performance and operating life of electronic devices as the development of modern electronic devices continues to miniaturize...
“Top-down” fabrication of anisotropic, lightweight, super-amphiphobic, and thermal insulating rattan aerogels
Abstract: Lightweight and sustainable aerogels have been a growing interest for thermal insulation applications due to current environmental and energy challenges. The design of cellulose-based...
Temperature adjustable thermal conductivity and thermal contact resistance for liquid metal/paraffin/olefin block copolymer interface material
Abstract: The adjustable thermal conductivity and thermal contact resistance are the key ways to realize efficient thermal management of electronic devices. In this work, a low melting-point...
Thermal Management in Electric Vehicles
C-Therm Technologies has been leading in the thermal management in electric vehicles by the optimization of using thermal conductivity measurements. As the climate crisis accelerates, electric...
Reducing thermal contact resistance by a novel elastomeric polyethylene glycol/unsaturated polyester resin/graphene thermal interface materials
Reducing thermal contact resistance (TCR) is an important way to enhance heat dissipation of electronic devices. Elastomer is easy to deform, increase the contact area and reduce the TCR, but its...
A systematic design to develop high-performance sintered particulate copper-composite as heat spreader material
A computational framework built on an effective-medium theory and mean-field homogenization is used to design particulate copper (Cu) composite for high-performance heat spreaders for electronic...
Micro-Macroscopic coupled modeling for the prediction of synergistic improvement on the thermal conductivity of boron nitride and multi-walled carbon nanotube reinforced composites
The use of hybrid fillers consisting of phycochemically different nanoparticles has been widely investigated to realize synergistic improvement of thermal conduction behaviors. The enhancement of...
Remarkably reduced thermal contact resistance of graphene/olefin block copolymer/paraffin form stable phase change thermal interface material
Highlights: A remarkably reduced thermal contact resistance of graphene/olefin block copolymer/paraffin is obtained. Critical thickness is proposed to quantitatively evaluate the dominant...