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Dielectric

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Modification of epoxy resin matrix by high-performance mesoporous silica@graphene nanocomposites
Abstract: High-performance composites were made with sheet graphene (GNP) and spherical silica (SiO2) as mesoporous nanofillers. The nanofillers are composed of SiO2 tightly wrapped on GNP by the...
Trident™ Application Highlight: Thermal Conductivity of Polymeric Thin Films Using the TPS Thin Films Utility
This document highlights the use of the Transient Plane Source (TPS) method, via the Thin Films Utility, in the characterization of thermal conductivity of polymeric thin films. Thin films are...
Trident™ Application Highlight: Accelerated Performance Validation of Thermal Adhesives for EV Battery Packs
This document highlights the use of the Modified Transient Plane Source (MTPS) method in the measurement of uncured and cured thermal interface materials during R&D formulation development. HB...
Trident™ Application Highlight: Thermal Conductivity of Thermal Interface Materials Measured with MTPS
This document highlights the use of the Modified Transient Plane Source (MTPS) method for characterizing the thermal conductivity of thermal interface materials (TIMs), including gap pads and potting...
Polymethyl methacrylate (PMMA) nanocomposites containing graphene nanoplatelets decorated with nickel nanoparticles for electromagnetic interference (EMI) shielding and thermal management applications
Abstract: In this work, nickel (Ni)@graphene nanoplatelet (GNP) nanohybrids were obtained via an interfacial reaction growth (IRG) method, and a series of poly(methyl methacrylate) (PMMA)/Ni@GNP...
Covalently bonded silica interfacial layer for simultaneously improving thermal and dielectric performance of copper/epoxy composite
Copper/epoxy (Cu/epoxy) composite is a kind of important thermal management material due to its high thermal conductivity, excellent mechanical robustness and low cost. However, susceptibility of Cu...