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Additive Manufacturing Aerogel Application Highlight Automotive Battery Bio-Based Insulation Blending Brochure Building Materials Ceramics Composites Dielectric Effusivity Electronics Emissivity Energy Storage Explosives Fiber/Fibre Flex Transient Plane Source Foams Geology Graphene Heat Transfer Fluids Insulation Liquids Metals Modified Transient Plane Source (MTPS) Method Nanomaterials Oil and Gas Optics Paste Phase Change Materials Photovoltaic Plastics Polymers Potting Compounds Powders Semiconductor TAL Textiles Thermal Conductivity Thermal Interface Materials Thermal Management Systems Thermal Radiation Thermoelectrics Thin Films
Trident™ Thermal Conductivity Application Highlight: Measuring Thin Film Samples using Flex TPS Sensor
The following Application Highlight addresses the measurement of polymeric thin films using the Flex Transient Plane Source (TPS) sensor and the Thin Films utility available on Trident.   Thin...
Trident™ Thermal Conductivity Application Highlight: Characterizing Performance of a Thermal Adhesive for EV Battery Packs
The following Application Highlight addresses the measurement of both an uncured and cured thermal adhesive material using the Modified Transient Plane Source (MTPS) method in collaboration with HB...
Trident™ Thermal Conductivity Application Highlight: Measuring Thermal Conductivity of Thermal Interface Materials with MTPS
The following Application Highlight features the use of the Modified Transient Plane Source method in the thermal conductivity testing of thermal interface materials (TIMs). TIMs are employed as a...
Polymethyl methacrylate (PMMA) nanocomposites containing graphene nanoplatelets decorated with nickel nanoparticles for electromagnetic interference (EMI) shielding and thermal management applications
Abstract: In this work, nickel (Ni)@graphene nanoplatelet (GNP) nanohybrids were obtained via an interfacial reaction growth (IRG) method, and a series of poly(methyl methacrylate) (PMMA)/Ni@GNP...
Covalently bonded silica interfacial layer for simultaneously improving thermal and dielectric performance of copper/epoxy composite
Copper/epoxy (Cu/epoxy) composite is a kind of important thermal management material due to its high thermal conductivity, excellent mechanical robustness and low cost. However, susceptibility of Cu...

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