Thermal Management of Cables and Electronics

The vast majority of the world’s global communications are transported via fiber optic submarine cables. The associated electronics are there to control system performance but generate a considerable amount of heat during operation. A system having high thermal dissipation and high electrical insulation is therefore desirable.

Submarine Network Optical Repeater [1]

A common strategy is to employ the use of thermally conductive dielectric resins/potting compounds for impregnation around the temperature-sensitive components. This can ultimately increase the equipment’s lifetime as well as allow for power increase at the same operating temperature level. A similar approach can be taken for applications in EV motors, batteries, etc.

From a thermal management perspective, improving the thermal conductivity of the material can be directly linked to an overall performance increase. However, while clearly beneficial, quantifying the overall improvement can be at times challenging. The introduction of anisotropy from fillers is a scenario that is becoming more prevalent and issues around filler dispersion are also of notable mention. C-Therm’s Trident with both the MTPS and the TPS methods is a great solution to support the innovative development of solutions for these problems.

Example of thermal conductivity measurement in anisotropic material using C-Therm’s FLEX TPS

This webinar will discuss the challenges presented when dealing with optimizing the heat dissipation performance of encapsulations for cables and other electronic packaging applications. Discussion of the thermal conductivity analysis will be highlighted throughout with a focus on C-Therm’s MTPS and FLEX TPS methods. The work is relevant for any engineers or development personnel concerned with thermal management in electronics, cables, and telecommunication hardware.

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