Composites using advanced polymers and reinforcements are a key enabler in the field of electronics packaging. Specifically, thermoset polymers are used extensively to “package” electronic components. An electronic package is used to connect the semiconductor chip to either substrates or printed circuit boards. Interestingly, polymer composites have an increasing impact on the electrical, mechanical, and thermal performance of electronic devices. Specifically, the talk will highlight the structure-property-process-performance relationships that are required for advanced electronics. Since thermosets are widely used, the process to transform small molecules into highly crosslinked networks requires specific attention. Chemistry (molecular structure and curing kinetics) and physics (rheology and process conditions) govern the final fully cured network polymers. Equally important is the strategic choice of fillers and reinforcements which are electrically conductive or alternately electrically insulating. The talk will focus on the challenges for the next generation of polymer composites used in advanced packaging such as mold compounds, underfills, and low dissipation factor dielectrics.
The webinar will also highlight how C-Therm’s Trident thermal conductivity instrument can be used for thermal mapping in thermally conductive, filler-loaded polymer composites.
To complement this, we will then explore how to evaluate the broader thermal behaviour of these advanced materials using Rigaku’s thermal analysis portfolio, including:
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Simultaneous Thermal Analysis (STA): combines mass change and heat flow measurements with in-situ sample observation to study decomposition, stability, and reaction behaviour.
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Differential Scanning Calorimetry (DSC): measures heat flow associated with curing reactions and phase transitions, providing insight into glass transition, crystallization, and cure kinetics.
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Thermomechanical Analysis (TMA): evaluates expansion, shrinkage, and softening behaviour as a function of temperature, helping define dimensional stability and process windows for thermoset-based packaging systems.
This webinar aired on December 16, 2025 2:00 pm GMT-4.
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