The thermal conductivity of silicone and non-silicone thermal interface materials (TIMs) under different compressed states was measured using the Transient Plane Source (TPS) method.
Thermal interface materials are typically applied within the interfaces between the layers, filling in the air gaps, improving the heat transfer rate, and ensuring that waste heat is dissipated away from critical components. Various factors define the effectiveness of TIMs in thermal management, including the type, composition, filler distribution, and bulk thermal conductivity (k) of the materials, the quality of the interface surfaces, and the applied loading conditions. It is important to note that choosing the correct type of TIMs, thermal pads, gels, or grease is highly dependent on the application's specific needs.
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