Copper (Cu) is among the most thermally conductive metals and is often selected for use as heat spreaders in electronics. The high thermal efficiency of copper makes it a better solution than some lower priced solutions.
As the thermal conductivity of the material is a critical performance attribute, an effective means of verifying the performance of the material is highly desirable. Ideally, researchers are seeking a fast, easy means of verifying the thermal conductivity of the material as incoming material quality increasingly becomes a concern.
C-Therm Modified Transient Plane Source (MTPS) technique was recently extended in offering a broader range of testing capabilities in highly-conductive metals. Recent test results on the three samples of pure copper are presented below:
C-Therm’s Trident Thermal Conductivity Platform is able to measure thermal conductivity using three methods, including the MTPS method mentioned above:
- Modified Transient Plane Source method
- Transient Line Source Method
- Transient Plane Source Method