Composites using advanced polymers and reinforcements are a key enabler in the field of electronics packaging. Specifically, thermoset polymers are used extensively to “package” electronic components. An electronic package is used to connect the semiconductor chip to either substrates or printed circuit boards. Interestingly, polymer composites have an increasing impact on the electrical, mechanical, and thermal performance of electronic devices. Specifically, the talk will highlight the structureproperty-process-performance relationships that are required for advanced electronics. Since thermosets are widely used, the process to transform small molecules into highly crosslinked networks requires specific attention. Chemistry (molecular structure and curing kinetics) and physics (rheology and process conditions) govern the final fully cured network polymers. Equally important is the strategic choice of fillers and reinforcements which are electrically conductive or alternately electrically insulating. The talk will focus on the challenges for the next generation of polymer composites used in advanced packaging such as mold compounds, underfills, and low dissipation factor dielectrics.
This webinar will air on December 16, 2025 2:00 pm GMT-4.
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