Cooling and thermal management of electronic devices, transformers and equipment is critical to boosting their performance and longevity. Thermal Interface Materials (TIMs) are applied between components to improve the thermal management and heat dissipation by drawing heat away from localized heat sources towards heat spreaders. TIMs are used in a variety of electronics, from the small scale like cellphones, to large applications like electric vehicles.
The thermal conductivity of TIMs is considered a critical performance attribute or specification to the material. Thermal interface materials may be liquids, pastes, or pads – but in all cases, they are designed to have high thermal conductivity, typically provide electrical isolation and ideally good thermal contact with heat sources. The thermal conductivity of the TIM is heavily influenced by its make up, usually with conductive fillers. One increasing area of research is silicon based TIMs.
Accurate thermal conductivity data is necessary for device design and material selection. This webinar reviews methods for thermal conductivity characterization of thermal interface materials and highlights application data from C-Therm’s clients.
This webinar aired on January 12, 2023 @ 2:00PM GMT-3.
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