A diagram showing the impact nanomaterials can have as an additive material in a polymer matrix. They serve to increase the mean free path, thereby increasing the thermal conductivity [1]
Thermal management is amongst one of the most important design factors with respect to electronic device performance, safety, and lifetime expectancy. When developing a thermal management system, the thermal conductivity of the materials involved can be viewed as a key design metric. Renewable energy systems, thermal energy storage and battery technologies are a few examples applications where the influence of temperature can have a large overall impact.
Often times, polymers have low thermal conductivities and therefore decreased thermal performance. To remedy this, conductive nanoparticles are used to increase the thermal conductivity of a polymer. This can be things like copper, alumina, graphene or carbon nanotubes. It is important to consider how these fillers impact the thermal conductivity, what the difference between different particles are, and how their dispersion will affect the end performance of the material.
C-Therm’s Modified Transient Plane Source (MTPS) sensor for thermal conductivity measurement.
In this webinar we will discuss important considerations for the characterization of thermal management systems and related sample types involving the incorporation of filler materials. C-Therm’s Modified Transient Plane Source (MTPS) and FLEX Transient Plane Source (TPS) methods will be highlighted as two of the most prominent methods for thermal analysis on these types of materials. Various case highlights will be explored with example data sets and published studies describing some of the recent advancements that are being done in this application space.
This webinar aired on October 20, 2022 @ 2:00PM GMT-3.
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