Thermomechanical Analysis (TMA) is a technique in which a deformation of the sample under non-oscillating stress is monitored against time or temperature while the temperature of sample in specific atmosphere is programed. The stress may be compression, tension, and flexure. TMA is widely used to measure the thermal expansion, shrinkage, softening temperature, glass transition temperature, and sintering of a sample. Rigaku’s TMA adopts the differential expansion principle that can measure the thermal expansion or shrinkage generated in insulators and semiconductors. Semiconductors are a class of crystalline solid intermediate that is electrically conductive in some circumstances, but not others.
There are two types of semiconductors; intrinsic semiconductors, known as n-type, and extrinsic semiconductors, known as a p-type. In extrinsic semiconductors/p-type, impurities are added into materials to enhance the charge carriers.
This webinar will feature the Rigaku TMA8311. It is a high-sensitivity, high-precision instrument, and provides measurements using a differential method that can be useful for the coefficient of thermal expansion (CTE) and thermomechanical analyzing of semiconductor materials. This will touch on the importance of understanding the thermal expansion and contraction of semiconductors, how this information can be applied to a system, and the unique ways that the Rigaku TMA is able to acquire these measurements. This webinar will interest anyone working with insulators and semiconductors (n-type and p-type).
Learn more about Rigaku’s products exclusively offered by C-Therm in the US here.
 Funahashi, S., Nakamura, T., Kageyama, K., & Ieki, H. (2011). Monolithic oxide–metal composite thermoelectric generators for energy harvesting. Journal of Applied Physics, 109(12), 124509.
This webinar aired on July 28, 2022 @ 2:00PM GMT-3.
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