Highlights from the Thermal Management Expo: Thermal Conductivity Mapping of Filled Materials

Presented by Arya Hakimian

The following topic was originally presented at the Thermal Management Expo in Novi, Michigan, May 2023.

As systems move towards electrification and smaller sizes, the importance of thermal management increases drastically. Improper thermal management can decrease the efficiency and lifecycle of the product, as well as pose a safety risk for the end user.

To improve thermal management, many groups are turning towards conductive fillers. These nanoparticles, such as boron nitride, alumina, graphene, among others, can drastically improve the thermal conductivity of the material. This is commonly being seen in thermal interface materials (TIMs) and composite materials.

However, uneven filler distribution within these materials can induce unexpected and undesirable thermal performances, causing products to perform in unintended ways. The Modified Transient Plane Source (MTPS) method of thermal conductivity measurement can be used to determine the quality of filler distribution. In particular, the small sensor size and fast test times allows for thermal mapping along the surface of a material to determine uneven thermal conductivity. Likewise, measurements can be taken on both sides of a material to determine if particle settling has occurred.

Join us for a webinar on the importance of thermal management, the importance of proper filler distribution, and how the MTPS can be used to determine distribution quality and end performance of these filled materials.

This webinar aired on May 11, 2023 @ 2:00PM GMT-3.

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