Thermal management is amongst one of the most important design factors with respect to electronic device performance, safety, and lifetime expectancy. When developing a thermal management system, the thermal conductivity of the materials involved can be viewed as a key design metric. Renewable energy systems, thermal energy storage and battery technologies are a few examples applications where the influence of temperature can have a large overall impact.
More and more frequently, additives are being incorporated to tailor specific thermal performance requirements. Conductive fillers such as carbon and metal nanomaterials are a popular choice for this type of application. While simply adding large amounts of a conductive filler tends to result in a net increase in thermal performance, these modifications can also result in the introduction of more novel material properties such as anisotropy. This can lead to more strict requirements from a measurement perspective to ensure the results obtain are truly representative of the tested material.
In this webinar we will discuss important considerations for the characterization of thermal management systems and related sample types involving the incorporation of filler materials. C-Therm’s Modified Transient Plane Source (MTPS) and FLEX Transient Plane Source (TPS) methods will be highlighted as two of the most prominent methods for thermal analysis on these types of materials. Various case highlights will be explored with example data sets and published studies describing some of the recent advancements that are being done in this application space.
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