Thermal Conductivity Testing of Liquid Metals & TIMs
As electronic devices become smaller and more powerful, effective thermal management is increasingly critical to performance and reliability. Liquid metals are emerging as promising thermal interface materials (TIMs), offering high thermal conductivity and the ability to conform to complex surfaces. However, understanding their thermal performance requires more than evaluating bulk conductivity alone.
Unlike conventional thermal greases, pastes, and gap fillers, liquid-metal TIMs introduce unique characterization challenges. Surface oxidation, wetting behavior, contact resistance, and bond-line thickness can significantly influence heat transfer across an interface. Accurate thermal characterization is essential for comparing formulations, optimizing material selection, and ensuring reliable performance in real-world applications.
In this webinar, C-Therm will explore practical approaches to measuring the thermal conductivity and thermal resistance of liquid metals and conventional TIMs. The session will discuss transient thermal conductivity measurement techniques, including Modified Transient Plane Source (MTPS), alongside ASTM D5470-based methods for evaluating thermal interface performance under controlled conditions.
Attendees will gain a better understanding of the key factors affecting liquid-metal TIM performance, the differences between bulk thermal conductivity and interface-level measurements, and how to select appropriate testing methods for advanced electronics, semiconductor packaging, and thermal management applications.
This webinar will air on November 24, 2026 2:00 pm GMT-4.
Register for the Webinar
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