As power densities continue to rise across AI data centers, high-performance computing, aerospace, defence, semiconductor packaging, and advanced electronics, thermal interface materials are playing a critical role in system reliability, heat dissipation, and long-term thermal management. Next-generation TIMs are being developed in more complex formulations and a wider range of form factors, including thermal greases, thermal pastes, gap pads, gap fillers, adhesives, gels, encapsulants, thin films, cured and uncured samples, anisotropic materials, low-volume samples, and liquid cooling materials.
This webinar will focus on thermal conductivity testing and thermal interface material characterization for next-generation TIMs used in demanding applications. Engineers and materials teams are often challenged with comparing formulations, validating supplier data, identifying filler dispersion issues, understanding compression-dependent performance, and generating reliable data that reflects real operating conditions. Accurate thermal testing is essential for accelerating material down selection, improving product development decisions, and reducing the risk of thermal performance failures later in the design process.
C-Therm’s Arya Hakimian, Application Scientist, and Genesis Infante, Lab Manager, will discuss practical testing workflows for evaluating TIMs across different material types, sample geometries, and application requirements. The session will highlight how C-Therm’s Trident platform can support rapid thermal conductivity measurement for R&D, material screening, thermal mapping, quality control, and technical data sheet validation. Trident can be used to evaluate a broad range of TIMs and related thermal management materials, including greases, pastes, pads, adhesives, cured materials, uncured materials, thin films, and cooling liquids.
The webinar will also discuss the ZFW TIM Tester and its role in evaluating thermal interface materials under conditions that better represent real assemblies. TIM Tester measurements are especially relevant for understanding thermal resistance, thermal impedance, apparent thermal conductivity, contact resistance, bondline thickness, and compression-dependent TIM performance. For materials such as thermal greases, gap pads, phase change materials, compressible pads, adhesives, and pastes, TIM Tester data can provide critical insight into how the material performs between two surfaces under controlled pressure and thickness conditions.
A key focus of the session will be representative testing conditions. TIMs used in data centers, aerospace systems, defence technologies, advanced electronics, and power electronics are often exposed to compression, elevated temperatures, pressure, humidity, thermal cycling, and aging. Testing under these application-relevant conditions helps engineering teams better understand how material performance may change over time and how different TIM formulations compare beyond a single room-temperature thermal conductivity value.
This session will also address standards-ready data and method selection. Attendees will learn how different thermal conductivity and TIM testing approaches can support internal R&D, technical documentation, customer validation, supplier comparison, and quality control. Topics will include workflows aligned with ISO 22007-2 for thermal conductivity testing and ASTM D5470 for thermal resistance and thermal impedance testing of thermal interface materials.
Whether your team is developing next-generation TIMs for AI data centers, liquid cooling systems, aerospace platforms, defence applications, semiconductor devices, EV power electronics, or high-performance electronic assemblies, this webinar will provide practical guidance on selecting the right thermal testing workflow for your material and application.
By the end of the webinar, attendees will understand how Trident and the TIM Tester can be used together to evaluate thermal conductivity, thermal resistance, thermal impedance, form factor flexibility, compression effects, and representative performance conditions for next-generation thermal interface materials.
Keywords: thermal interface materials, TIMs, next-generation TIMs, thermal conductivity testing, TIM testing, TIM Tester, ZFW TIM Tester, Trident, thermal characterization, thermal resistance, thermal impedance, apparent thermal conductivity, contact resistance, bondline thickness, ASTM D5470, ISO 22007-2, thermal greases, thermal pastes, gap pads, gap fillers, adhesives, thermal adhesives, cured samples, uncured samples, thin films, anisotropic materials, cooling liquids, liquid cooling, data center cooling, AI data centers, high-performance computing, aerospace, defence, advanced electronics, semiconductor packaging, power electronics, thermal management, material down selection, standards-ready data, representative testing conditions.
This webinar will air on July 15, 2026 2:00 pm GMT-3.
Register here