As thermal interface materials become increasingly important in high-power electronics, semiconductor packaging, EV systems, aerospace, and data center applications, thermal conductivity alone does not always provide a complete picture of real-world performance. Material thickness, contact resistance, compression, and interface conditions can all significantly influence how effectively a TIM transfers heat in its final application.
In this webinar, we will take an in-depth look at the ZFW TIM Tester, a high-accuracy testing system designed to evaluate thermal interface materials in accordance with ASTM D5470. The session will cover how the instrument measures key properties including thermal resistance, thermal impedance, apparent thermal conductivity, and thermal contact resistance.
We will also explore the system’s ability to measure bond-line thickness, helping users understand how a material behaves under controlled pressure and at application-relevant thicknesses. Attendees will learn how these measurements can support material comparison, supplier data validation, formulation development, quality control, and the evaluation of TIM performance under more representative operating conditions.
The webinar will include an overview of the testing principles, instrument capabilities, sample considerations, and practical examples involving materials such as thermal greases, gap fillers, pads, adhesives, gels, and other thermal interface materials.
This webinar will air on August 4, 2026 2:00 pm GMT-3.
Register here