Thermal Conductivity Testing for AI Data Centers

As AI and high-performance computing continue to increase power densities within data centers, effective thermal management is becoming increasingly dependent on the materials used throughout the electronics and cooling system. From thermal interface materials and electronic substrates to encapsulants, adhesives, and liquid coolants, thermal conductivity plays a critical role in determining how efficiently heat can be transferred away from sensitive components.

This webinar will explore thermal conductivity testing for the key materials used in next-generation data centers. The session will cover the unique measurement challenges associated with different material types, including thin and compressible TIMs, anisotropic substrates, filled polymers, encapsulants, adhesives, and low-viscosity cooling fluids. We will also discuss how factors such as sample thickness, contact pressure, filler distribution, temperature, and convection can influence thermal conductivity results.

Attendees will learn how different testing approaches can be used to support material screening, supplier data validation, formulation development, quality control, and performance testing under more representative operating conditions. The webinar will highlight practical considerations for selecting an appropriate measurement method based on the material form, conductivity range, sample geometry, and intended application.

By connecting thermal conductivity data with real-world material performance, this session will help engineers, researchers, and materials teams make more informed decisions when developing and evaluating thermal management solutions for AI data centers, advanced electronics, and liquid cooling systems.