Thermal Resistance (R) is a measure of resistance to heat flow through a given thickness of material (related directly to the R-value). Thermal resistance is determined by taking the thickness of a sample and dividing it by its thermal conductivity. Thermal resistivity is the inverse of the thermal conductivity. Thermal resistivity and R-value are sometimes used interchangeably, however, thermal resistivity differs in that it is a material property (i.e. independent of thickness).
Thermal resistance is specifically used to compare the performance of insulation products. Insulation can take the form of foams, aerogels, or other thermal barrier materials. R-value is often used to quantify single layered samples but can also be applied to layered structures such as those in vacuum insulation panels.
A range of both transient and steady state methods are available for testing at TAL. The Heat Flow Meter (HFM) is considered the gold standard method for determining the thermal resistance of insulation. HFM allows us to measure the thermal conductivity from -10 to 60 °C, and we offer services with multi-temperature point measurements, within ASTM C518-17 specifications (see general HFM design schematic below). The Modified Transient Plane Source (MTPS) is well-suited for a wide range of materials. Specifically, the high-temperature MTPS configuration is ideal for testing insulations used in elevated temperature applications. Learn more about our equipment for thermal conductivity and thermal resistance testing here.
We offer MTPS and HFM testing for the thermal resistance of insulation, foams and other materials. Below is a selection of the measurement requirements for thermal resistance testing services.
|0.002 – 1.0 W/mK
|100 x 100 mm or 300 x 300 mm.
Min. thickness of 5 mm.
|-10 – 60 °C
|Foams, aerogels, polymers and vacuum insulation pannels
|ISO 8301, ASTM C518, EN 1946-3, EN 12664, EN 12667, EN 12939
|0 – 0.150 W/mK
|Min. diameter of 18 mm.
Min thickness is dependent on the thermal conductivity. For materials under 1W/mK, a minimum thickness of 1 mm is suggested.
|25 – 500 °C
|Foams, solids and powders
Other methods may be available. Contact us at firstname.lastname@example.org or call (506) 457-0498 to discuss.
I was completely satisfied with the testing experience.
Vice President of Technology
I was well pleased with the experience. The instructions for the sample configuration was clear. The people responded promptly to questions. The lab double checked results to address any questions. The report was clear, easily understood.
Vice President of Technology
I am very happy with the testing services I received from Thermal Analysis Labs. I’ve found them very responsive, and they were able to get us the data we needed to get quickly so that we could use it to validate our designs. I refer my other colleagues to them, and they’re my go-to group for thermal testing.
Scott Kramer, PEng.,
Principal R&D Engineer
I sought thermal conductivity testing from Thermal Analysis Labs to aid in device design. My group has experienced good customer service with speedy sample processing and fast turnaround time. I would be happy to recommend this group to anyone looking for this service.
Project & Supply Chain Manager
I’ve outsourced thermal testing of several materials to TAL. My experience has been very positive. Their professionalism shows in management, quality of work, and customer service. They are always eager to accommodate my needs and timeline. I highly recommend their services.
Thermodynamics and CFD Group Manager
All data and reports were very helpful and we appreciate your support; you did an amazing job to conduct the tests and confirm the reports within such a short time frame. This really helped us get out of jam and your support meant a lot to our efforts with our customer. We will certainly contact you again on these matters.
Thermal Analysis Labs has provided great service for all our materials testing needs by providing quick turn-around testing results while also providing the service for a reasonable cost. TAL’s professional approach to our material testing request has also provided great insight to the materials being tested and the best method to achieve the measurements. TAL has been an invaluable resource for our product development process.
Fellow Engineer, Advanced Concepts
I had a request for thermal conductivity information on one of my adhesives and contacted Thermal Analysis Labs. The process was very smooth – I experienced none of the issues typical of other contract labs we work with. The results were delivered on time and I have used the data in our sales literature to help my clients have success in their applications.
Vice President of Sales