Thermal Conductivity Enhancement of Polymer Composites with Copper Nanowires as Functional Fillers
In recent studies, nanowires have become interesting filler materials for thermal and electrical conductivity enhancement. Compared to traditional carbon allotrope fillers, which can be expensive and difficult to manufacture, nanowires have a lower cost and higher thermal and electrical conductivity. Furthermore, it is well-known that the thermophysical properties of nanowires are tailorable by changing the morphology of the wire.
Among various nanowires, copper nanowires (CuNWs) have received an intensive attention due to their superior electrical and thermal conductivity. It has also been confirmed that the morphology of CuNWs plays an important role in the performance of polymer composites with CuNWs as functional fillers.
This webinar will focus discussion on the application of the C-Therm TCi Thermal Conductivity Analyzer in characterizing the thermal conductivity enhancement of CuNW-filled silicone composites and soft elastomers. Recent published journals in the Nanoscale Research Letters and the Advanced Materials Interfaces will be presented based on work from C-Therm clients at Shanghai Polytechnic University, Indian Institute of Technology Bombayand Monash University.
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