A Review on Thermal Properties of Epoxy Composites as Thermal Interface Material
Heat dissipations in electronic devices have become a challenge and area of research for thermal management. Thermal interface materials are used to improve the heat transfer in electronic devices. Epoxy resin is widely used as a thermal interface material because of its excellent property over other thermal interface materials. The past researches show that the incorporation of filler materials of high thermal conductivity improves the thermal conductivity of epoxy composites, consequently improves the heat transfer in electronic devices. In this review paper the need of thermal interface material and epoxy as a thermal interface material are discussed. The review paper also includes the various types of filler material used for thermal conductivity enhancement of epoxy composites and their effect on thermal properties of epoxy composites.
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