Testing Procedure for Testing the Thermal Conductivity of Adhesive Paste
The thermal conductivity of adhesives developed for the appliance, automotive, lighting, medical and microelectronics industries is a criticial performance specification. Epoxies, silicones and urethanes are frequently formulated with filler material (e.g. graphite, boron nitride, silver, etc) to enhance the effective heat dissipation capability of the composite material. These materials are employed where electrical isolation is requierd, but high heat dissipation is still needed. Such thermal interface materials can take a variety of forms ranging from solids, liquids, and pastes.
The versatility of the C-Therm TCi Thermal Conductivity Analyzer in testing such a wide variety of materials is one of the reasons the technique is preferred by many manufacturers of thermal interface materials.
Recently, the thermal conductivity of an adhesive paste was tested here at C-Therm;
C-Therm TCi Thermal Conductivity analyzer was employed to test the thermal conductivity of the material with the Compression Test Accessory (CTA).
Thermal conductivity results are presented below for the paste which is described by the manufacturer as having good electrical insulating properties with good adhesion and viscosity stability.
|Test||Thermal Conductivity (W/mK)|
For more information testing thermal interface materials see also our recent webinar on the topic.