Feb. 13, 2018
This study summarizes the most important results of a research project dealing with the comprehensive investigation of the bonding mechanisms between cold-sprayed Al coatings and various poly and...
Feb. 07, 2018
Researchers at The Case Western Reserve University recently published an application paper on Accommodating Volume Change and Imparting Thermal Conductivity by Encapsulation of Phase Change...
Sep. 29, 2017
Precise and accurate thermal conductivity measurements are important in geology for numerous reasons. Determining the effectiveness of geothermal heat transfer and dissipation through different...
Sep. 19, 2017
High temperature thermal conductivity measurements are important for exploration and performance evaluation of materials existing in high temperature environments. Insulating materials with low...
Sep. 08, 2017
Fig. 1 shows the thermal conductivity of the nanocomposite thin films in relation to the graphene content. The work highlights application of a C-Therm TCi Thermal Conductivity Analyzer in...
Apr. 04, 2017
Part I: Opaque Samples
Part II: Special Considerations for Glasses and Other Transparent Samples
Mar. 29, 2017
TLS Application:Testing the Thermal Conductivity of Papayas in Determining Appropriate Freezing Time
In this work – we summarize how to measure the thermal conductivity of papaya (Carica papaya) for such purposes. The papaya fruit is a tropical fruit commonly cultivated in in India, Brazil,...
Feb. 10, 2017
Sarah Ackermann attended the ASTM D13.51 subcommittee meeting in Norfolk, Virginia. One of the primary agenda items for discussion was the need to proceed with the ILS study for ASTM Standard...
Feb. 06, 2017
All values in the table are defined at room temperature. As a rule-of-thumb, the thermal conductivity increases with a few percent in the range 0-100°C. Only below very low temperatures (typically...
Jan. 31, 2017
Researchers at King Fahd University of Petroleum and Minerals recently published an application paper on Development of a Ceramic-based Composite for Direct Bonded Copper Substrate. A computational...